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IC Packaging Thermal - Mechanical Modeling Intern - Irvine

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Skyworks Solutions, Inc.

Sep 24, 2023

Applications are closed

  • Internship
    Full-time
    Off-cycle Internship
  • Engineering
  • Irvine

Requirements

  • Qualifications and Education Requirements:
  • Currently pursuing a Bachelor's or Master's degree in Mechanical Engineering, Materials Science, or a related field.
  • Strong interest in heat transfer, solid mechanics, finite element analysis and its applications in semiconductor packaging.
  • Strong problem-solving and analytical skills.
  • Excellent communication and teamwork abilities, with a desire to collaborate effectively in a multidisciplinary environment.
  • Preferred Skills:
  • Familiarity with FEA software (e.g., ANSYS, COMSOL) is a plus, but not mandatory. Willingness to learn and apply FEA techniques is essential.
  • Basic understanding of semiconductor packaging concepts and materials is advantageous.
  • Proficiency in using CAD tools for package modeling is a bonus.

Responsibilities

  • Become familiar with various IC packaging structures and the process steps involved in making the end product.
  • Learn the basics of using numerical analysis tools such as ANSYS, Icepak etc.
  • Start developing simple package level mechanical Finite Element Analysis (FEA) Models to characterize stress/strain in the packages due to various assembly process steps.
  • Start developing simple FEA models to capture the various accelerated testing conditions that ensures long term package reliability.
  • Become familiar with the fundamentals of heat transfer in IC packages and the various thermal related nomenclatures and parameters as specified in standards documents.
  • Start developing thermal FEA models to characterize the package level thermal resistance and other thermal performance parameters.
  • Learn to use statistical tools such as JMP to create statistical models that can predict DPPM level failure rates in high volume manufacturing.
  • Learn to interpret the thermal/mechanical behavior of models and simulation results and correlate to observed behavior and measurements.
  • Document all simulation models, codes and scripts and present the results in simple and clear terms to a broader audience.
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Skyworks Solutions, Inc.

Connecting Everyone and Everything, All the Time

Manufacturing & Electronics
Industry
5001-10,000
Employees

Mission & Purpose

Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the aerospace, automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets. Skyworks is a global company with engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America and is a member of the S&P 500® and Nasdaq-100® market indices (NASDAQ: SWKS

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