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Packaging Engineering Intern

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Texas Instruments

26d ago

  • Internship
    Full-time
    Summer Internship
  • Research & Development
    Engineering
  • Dallas

AI generated summary

  • You should be pursuing a relevant bachelor's degree, have a 3.0 GPA or higher, possess semiconductor knowledge, programming basics, strong communication, teamwork, and time management skills.
  • You will collaborate on semiconductor packaging design and development, joining teams to advance technologies like Wirebond and Flip Chip, while focusing on materials, mechanics, and characterization.

Requirements

  • Currently pursuing an Bachelors degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics or Electrical Engineering.
  • Cumulative 3.0/4.0 GPA or higher
  • Semiconductor packaging knowledge is preferred (processes, assembly, reliability, materials, characterization, FA)
  • Basic understanding of programming, automation and data analysis
  • Demonstrated analytical and problem solving skills
  • Strong written and verbal communication skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Strong time management skills that enable on-time project delivery
  • Ability to build strong, influential relationships
  • Ability to work effectively in a fast-paced and rapidly changing environment
  • Ability to take the initiative and drive for results

Responsibilities

  • Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.

FAQs

What is the job title for this position?

The job title is Packaging Engineering Intern.

What educational qualifications are required for this internship?

Candidates must be currently pursuing a Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or Electrical Engineering.

Is there a minimum GPA requirement to apply for this position?

Yes, a cumulative GPA of 3.0/4.0 or higher is required.

What kind of knowledge is preferred for applicants?

Semiconductor packaging knowledge is preferred, including understanding of processes, assembly, reliability, materials, characterization, and failure analysis.

Are there any programming skills required for this role?

A basic understanding of programming, automation, and data analysis is preferred.

What skills are important for success in this internship?

Important skills include analytical and problem-solving abilities, strong written and verbal communication skills, teamwork and collaboration skills, time management, and the ability to take initiative.

Is Texas Instruments willing to sponsor work visas for this position?

No, Texas Instruments will not sponsor job applicants for visas or work authorization for this position.

What kind of work environment can interns expect at Texas Instruments?

Interns can expect a fast-paced and rapidly changing work environment that encourages collaboration and innovation.

What benefits does Texas Instruments offer to its employees?

Texas Instruments offers competitive pay and benefits aimed at helping employees and their families live their best lives.

Does Texas Instruments practice equal opportunity employment?

Yes, Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to various personal characteristics protected by law.

How can interested candidates apply for this position?

Interested candidates should apply to the designated requisition for this position.

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Texas Instruments

Manufacturing & Electronics
Industry
10,001+
Employees

Mission & Purpose

Texas Instruments has been making progress possible for decades. We are a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. Our more than 80,000 products help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. Our passion to create a better world by making electronics more affordable through semiconductors is alive today as each generation of innovation builds upon the last to make our technology smaller, more efficient, more reliable and more affordable – opening new markets and making it possible for semiconductors to go into electronics everywhere. We think of this as Engineering Progress. It’s what we do and have been doing for decades.