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Summer 2024 Package Reliability Engineering Co-Op/Intern

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Advanced Micro Devices (AMD)

Feb 2, 2024

Applications are closed

  • Internship
    Full-time
    Starts on May 19
    Summer Internship
  • Software Engineering
  • $91.5K - $137.3K
  • Austin

Requirements

  • Familiarity with commercial finite element analysis (FEA) software
  • FEA with hardware experience
  • Experience with heat transfer and linear/non-linear mechanics FEA - (applied to electronics applications)
  • Experience validating FEA simulation to empirical data
  • Statistical analysis using JMP or Excel
  • Mechanical Engineering background is a plus!
  • Computational and Statistical background is a plus!
  • Ansys Sherlock, Ansys Workbench is a plus!
  • Electro-thermal analysis is a plus!
  • Currently enrolled in an accredited US University - MS or PhD students.
  • Currently studying: Mechanical Engineering, Statistical Science, Computational Mechanics, or Electronics.
  • Heat Transfer and/or Solid Mechanics background
  • Knowledge and application of Statistical concepts
  • Familiarity with Semiconductor electronics manufacturing - packaging and reliability
  • Develop high quality technical documentation.
  • Communicate across teams and departments to collect supporting data and information and solve package reliability related technical issues.
  • Strong organizational, computer, analysis, and communication skills
  • Collaborative spirit and can-do attitude!

Responsibilities

  • Package Reliability Engineering is a technical organization that provides full lifecycle reliability engineering support across business units while collaborating with several cross-functional teams. It is responsible for ensuring robust long-term reliability of AMD products, both ASIC packages and graphics cards.
  • The team utilizes design for reliability concepts to enable analysis and risk assessments of early product designs, support material characterization/selection, conduct numerical simulations, contribute to product development phases and drive product qualification to enable successful NPI launches and sustaining support.
  • In this position, you will utilize numerical simulation tools and physics of failure concepts to build models and perform statistical analysis of test data, to accomplish near-term deliverables and complement to the team’s technical knowledgebase in developing robust solutions.
  • You will learn to work in a fast-paced Global technical team environment. The work you do will positively impact AMD’s next generation of cutting-edge products, along with providing you with a better understanding of AMD’s culture, new product introduction process (NPI), Package Reliability Engineering function, and use of Simulation tools for design and risk analysis.
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Advanced Micro Devices (AMD)

together we advance_

Manufacturing & Electronics
Industry
10,001+
Employees
1969
Founded Year

Mission & Purpose

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. AMD together we advance

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