FAQs
What is the duration of the co-op position?
The co-op position lasts either from May 27, 2025, to August 8, 2025, or from June 23, 2025, to September 12, 2025.
Where is the position located?
The position is located in Austin, TX, United States.
Is this position full-time?
Yes, this position requires the student to work full-time, 40 hours a week.
What are the educational requirements for this position?
Candidates must be currently enrolled in a United States based University pursuing a Ph.D. in Mechanical Engineering, Material Science, Aerospace Engineering, or related fields.
What technical skills are preferred for this role?
Preferred skills include familiarity with packaging structure, semiconductor theory, and strong organizational, computer, and communication skills.
Is experience in advanced packaging required for this role?
No, advanced packaging experience is a plus but not required.
What type of projects will I be working on during this co-op?
You will work on projects related to packaging technology, package design, thermal interface materials, and new package platform development, among others.
Will I have opportunities for mentorship during the internship?
Yes, the program provides one-on-one mentorship and networking opportunities with AMD leaders.
Can I apply if I am not a U.S. citizen?
The job listing does not specify citizenship requirements, but it is advisable to check with AMD's recruitment policies.
Are there opportunities for career development during the co-op?
Yes, the co-op offers opportunities to collaborate with experienced engineers and gain hands-on experience that can give you a competitive edge in your career.