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2024 Summer/Fall Packaging Engineer Intern (Advanced Degree) - Austin, TX

🚀 Summer Internship


AI generated summary

  • You must have a Master's or Doctorate in Chemical Engineering, strong chemistry knowledge, project management skills, and ability to work autonomously in a fast-paced environment. Knowledge in advanced packaging architecture and electrical/computer engineering is a plus.
  • You will conduct literature reviews, present findings, set up experiments, solve problems with new materials, define integrated flows, validate results in the lab, and travel domestically as needed.

Summer Internship

Science, EngineeringAustin


  • Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale helps our customers – who make smartphones, supercomputers, virtual reality headsets, autonomous vehicles and more – transform their ideas into reality. Our innovations Make Possible® a Better Future.
  • Inside our company, we apply the idea of make possible as we work together. We value our people and teams who turn possibilities into reality by advancing our strategy, accomplishing great things and empowering others. We are deeply committed to fostering a Culture of Inclusion where every person knows they belong, feels empowered to bring their whole self to work, and is inspired to grow.
  • If you’re looking for a great place to grow your career, consider Applied Materials. With the data explosion and new investment in semiconductors, it’s an exciting place to be.
  • Applied Materials’ Advanced Packaging Department is searching for an intern to join our team in summer/fall 2024! Advanced packaging technology is critical to continue enabling Moore’s law through heterogenous integration of chiplets. Chiplets are integrated on the package thanks to novel wafer level processes such as hybrid bonding. New materials selection and integration within the hybrid bonding process flow are key to scale the next generation of interconnects. This internship will be focusing on advanced Packaging process integration for interconnect scaling . 


  • Student must be pursuing a Master's or Doctorate degree program in Chemical Engineering or a related field.
  • Student must be in good academic standing at their university, with a preferred GPA of 3.0 or above on a 4.0 scale
  • Strong understanding of chemistry of materials behavior and electro-chemical reactions
  • Operate in high pace environment with autonomy.
  • Model-based problem-solving attitude with high tolerance for ambiguity is a plus for successful candidates.
  • Project Management skills
  • Knowledge of advanced packaging architecture is preferred.
  • Electrical or Computer Engineering or related field with package design and Signal/Power Integrity analysis knowledge is a plus

Education requirements

Currently Studying

Area of Responsibilities



  • Literature review focused on substrate, 2.5D and 3D architectures
  • Present key finding and data summary in weekly meeting in front of engineering team
  • Set-up DOE and track outcome
  • Model based problem solving regarding new materials introduction and qualification.
  • Define integrated flows to enable target outcome
  • Lab validation of advanced result (inspection, metrology)
  • Up to 10% of domestic travel


Work type

Full time

Work mode