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🚀 Internship

Graduate Intern - PhD

🚀 Off-cycle Internship

San Francisco +3

🤑 $63K - $166K
⌛ Closed

AI generated summary

  • The ideal candidate for the Graduate Intern - PhD position at Intel Corporation must be pursuing a PhD in material sciences or related areas and should have demonstrated hands-on experience with EBSD, SEM/EDS, and metallography sample preparation. Additionally, research experience on interconnects of advanced electronic packaging is preferred.
  • The candidate will work in a dynamic team, analyzing complex datasets and developing proof of concepts and prototypes in microelectronic technology. They will collaborate with engineers to understand interconnect failure mechanisms, present technical topics, and communicate effectively with various stakeholders.
Applications are closed

Off-cycle Internship

ScienceSan Francisco, Philadelphia, Phoenix, Los Angeles

Description

  • Candidate will be performing lab experiments and characterizations on Cu and solder interconnects in advanced electronic packaging; Metallography sample preparation for SEM/EBSD examinations; Work with Physical Failure Analysis teams on electronic packaging interconnect failure mechanisms.

Requirements

  • You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
  • Minimum Qualifications:
  • The candidate must be pursuing a PhD degree in material sciences or related areas.
  • Demonstrated Hands-on experiences with EBSD, SEM/EDS and metallography sample preparation.
  • Preferred Qualifications:
  • Research experiences on interconnects of advance electronic packaging.

Education requirements

Currently Studying
PhD

Area of Responsibilities

Science

Responsibilities

  • Possess good problem-solving skills, ability to work in a dynamic and multi-functional team and the willingness to learn key concepts of microelectronic technology development.
  • Experiment with various approaches involving complex datasets, create proof of concepts and prototypes of new ideas and support strategic enhancements to existing models.
  • Work with Engineers from diverse engineering backgrounds to help understand interconnect failure mechanisms.
  • Present and report on related technical topics.
  • Excellent communication skills to both technical and non-technical audiences, including higher management, internal and external customers.

Details

Work type

Full time

Work mode

office

Location

San Francisco, Philadelphia, Phoenix, Los Angeles

Salary

63000 - 166000 USD

Benefits

  • Competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.