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Mechanical Test and Automation Engineering Intern

🚀 Off-cycle Internship


AI generated summary

  • You must be pursuing a degree in Mechanical Engineering, computer science, or mechatronics with a minimum 3.0 GPA. Knowledge of Python, CAD tools, CFD/FEA software, general lab testing, and hands-on skills are needed. Automation knowledge and a GPA of 3.5 or higher preferred.
  • You will assist in developing data center thermal/mechanical solutions across server and workstation segments, collaborating with a multidisciplinary team and aiding in test fixture and automation development.

Off-cycle Internship

Software EngineeringHillsboro


  • The Data Platforms Engineering and Architecture (DPEA) Group invents, designs & builds the world's most critical computing platforms which fuel Intel's most important business and solve the world's most fundamental problems. DPEA enables that data center which is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.


  • Must be pursuing a Bachelor's degree in a Mechanical Engineering, computer science or mechatronics program.
  • Must have at least a 3.0 cumulative GPA.
  • Preferred Qualifications:
  • Knowledge of Python, C++ or other scripting languages
  • Knowledge of 3D CAD tools like Creo or Solidworks.
  • Knowledge of CFD tools like FloTherm or IcePak
  • Knowledge of FEA tools such as Abaqus or Ansys
  • Knowledge of mechanical structural fundamentals and basic heat transfer processes.
  • Knowledge of computer layouts and basic architecture.
  • Familiarity with general lab testing procedures such as basic instrumentation, data acquisition, fixture design, etc.
  • Demonstrated hands on ability with common tools.
  • Familiarity with common manufacturing and design processes such as: sheet metal, plastic injection molding, machining, die casting, cold forming, etc. is a plus.
  • Preferred to have at least a 3.5 or higher cumulative GPA.
  • Knowlege of automation for software or hardware.

Education requirements

Currently Studying

Area of Responsibilities

Software Engineering


  • Candidate will assist in the development of data center thermal/mechanical solutions for various server and workstation market segments by working with a team of cross-site architects, mechanical, thermal, structural, and electrical engineers. Candidate may also assist with development of test fixtures and test automation.


Work type

Full time

Work mode