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Summer 2024 Intern, Wafer Manufacturing Engineering

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Western Digital

Mar 13

Applications are closed

  • Internship
    Full-time
    Summer Internship
  • Engineering
  • Fremont

Requirements

  • Currently enrolled in a MS / PhD Program in Engineering, Material Science, Physics, chemistry or related engineering field.
  • Strong analytical and quantitative problem-solving ability.
  • Strong team-player who can collaborate with colleagues.
  • Good written and verbal communication skills.
  • Preferred:
  • Understanding of microelectronics wafer fabrication process including CMP, photolithography, dry or wet etching, electroplating, or thin film deposition processes.
  • Strong hand-on experience and willing to work in wafer fab.

Responsibilities

  • The candidate will be responsible to support manufacturing CMP process in a wafer manufacturing environment. Interns in this group can expect to learn about and gain experience in the following areas:
  • Sustain the production line, monitor processes and equipment to ensure minimal deviations and meeting both quality and quantity specifications.
  • Work in the production line to improve process quality/sigma, cycle time, throughput, defects, and line yield.
  • Work with individual process engineers and equipment engineers for process and tool qualification.
  • Perform wafer failure analysis, troubleshooting, and implement corrective and preventive actions.
  • Drive project planning, execution, summary, presentation, and delivery on time.

Western Digital

We create data storage solutions that power the technology of today and inspire the innovations of tomorrow.

Technology
Industry
10,001+
Employees

Mission & Purpose

At Western Digital we create data storage solutions that power the technology of today and inspire the innovations of tomorrow.