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Summer 2024 Intern, Wafer Manufacturing Engineering

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Western Digital

1mo ago

🚀 Summer Internship


⌛ Closed
Applications are closed

Summer Internship



  • At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.
  • At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.


  • Currently enrolled in a MS / PhD Program in Engineering, Material Science, Physics, chemistry or related engineering field.
  • Strong analytical and quantitative problem-solving ability.
  • Strong team-player who can collaborate with colleagues.
  • Good written and verbal communication skills.
  • Preferred:
  • Understanding of microelectronics wafer fabrication process including CMP, photolithography, dry or wet etching, electroplating, or thin film deposition processes.
  • Strong hand-on experience and willing to work in wafer fab.

Education requirements

Currently Studying

Area of Responsibilities



  • The candidate will be responsible to support manufacturing CMP process in a wafer manufacturing environment. Interns in this group can expect to learn about and gain experience in the following areas:
  • Sustain the production line, monitor processes and equipment to ensure minimal deviations and meeting both quality and quantity specifications.
  • Work in the production line to improve process quality/sigma, cycle time, throughput, defects, and line yield.
  • Work with individual process engineers and equipment engineers for process and tool qualification.
  • Perform wafer failure analysis, troubleshooting, and implement corrective and preventive actions.
  • Drive project planning, execution, summary, presentation, and delivery on time.


Work type

Full time

Work mode