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Entry Level Equipment, Process, and Manufacturing Engineers - December 2023 and May 2024 Grads

💼 Graduate Job


AI generated summary

  • Seeking recent graduates with BS or MS in engineering or physics, with up to 2 years of experience, including internships. Must have knowledge of Lean principles, semiconductor fabrication processes, statistical process control, quality improvement methods, troubleshooting skills, and teamwork abilities. Strong communication skills, proficiency with data analysis tools, and a positive attitude are essential, along with the ability to adapt in a fast-paced environment and collaborate with diverse teams.
  • The Entry Level Engineers will be responsible for monitoring and controlling wafer fabrication processes, improving equipment reliability, reducing defects, working on process improvements, collaborating with cross-functional teams, developing process specifications, analyzing data analytics, and addressing material and processing issues to enhance the quality and reliability of products for NXP Semiconductors.

Graduate Job



  • Equipment, Process, Packaging, and Quality Engineers
  • Our Operations and Manufacturing Groups play an essential role in the company’s success by ensuring the delivery of high quality, scalable, cost-competitive technologies, and supply to create a competitive advantage for our customers. Our manufacturing plants, or wafer fabs, are run by Equipment, Process, and Manufacturing Engineers, who use their experience and skills to make sure the products we turn out are the best in the industry.
  • Engineers might work with Photo, Etch, or Implant Machinery,


  • BS or MS in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, or similar is required, along with up to 2 years experience, including internships
  • Experience or coursework in the following are helpful in determining where you’d best fit in:
  • Knowledge of statistical process control
  • Knowledge of Lean principles and Lean Manufacturing techniques
  • Theoretical and/or practical knowledge of semiconductor fabrication processes,
  • Experience in Lean Manufacturing a plus
  • Ability to deal with multiple issues and shifting priorities
  • Strong verbal and written communication skills
  • Ability to interact with multiple disciplines in a 7x24 manufacturing facility
  • Strong verbal and written communication skills
  • Good Teamwork and a desire to work with people to create a positive work environment
  • Excellent Troubleshooting skills
  • Use of Oscilloscope and reading and understanding waveforms
  • Knowledge of quality improvement methods including FMEA, 8D and 3x5 Why is required.
  • Demonstrated skill in handling of customer complaints, from failure analysis to execution of root cause corrective action and implementation of best practices is a must.
  • Candidate must have excellent interpersonal and communication skills and be experienced with Microsoft Office and statistical data analysis tools such as JMP or Stata.
  • Working knowledge of Tableau and SQL is desired
  • Six-sigma Black Belt training highly desired
  • Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.
  • Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.
  • Knowledge of Statistical Analysis and Design of Experiment is a plus.
  • Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.

Education requirements


Area of Responsibilities



  • Responsible for monitoring and controlling wafer fabrication processes and equipment
  • Implementation of Six-Sigma statistical process control methods
  • Prevent and reduce wafer scrap and defectivity
  • Improve equipment reliability and availability
  • Participate in cross-functional and Lean activity teams
  • Define manufacturing procedures
  • Develop and write process specifications
  • Determine root cause of defect issues, and drive resolution.
  • Partner with other engineers to reduce tool-level defect levels (both excursion reduction and baseline improvement)
  • Sample submissions process and validation of all required documentation
  • Develop tools to improve processes (ie. ADEPT, Databases, Tracking, Quartz)
  • Organize, implement and optimize production process flow
  • Develop working instructions and process documents
  • Sustain and improve processes to meet manufacturing demand for throughput and cycle time
  • Improve quality levels by driving to root cause to eliminate scrap and yield loss mechanisms
  • Identify and execute cost reduction solutions to meet Factory budget goals
  • Collaborate across teams to improve overall process performance
  • Reduce defectivity mechanisms and improve process control
  • Work with minimal supervision, balancing competing priorities, to serve the needs of the engineering and manufacturing communities
  • Work collaboratively with process and product engineers to enhance the quality and reliability performance of NXP products.
  • Utilize data analytics to help identify customer return common causes and evaluate the effectiveness of corrective actions across a wide range of products and technologies.
  • Serve as a focal point in the organization for structured problem solving, and as a liaison between the manufacturing and product organizations.
  • Establish, monitor, and develop improvement plans for quality key performance indicators.
  • Define and validate package designs, materials and processes used for development of new products for NXP.
  • Develop DOE’s and tests to evaluate suitability and reliability of package solutions.
  • Work with the Business Lines and the factories (both internal to NXP and subcons) to qualify the package/product solutions.
  • Manage the package process using industry standard project management tools.
  • Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing).
  • Address and solve materials and processing issues that may occur during the development process.


Work type

Full time

Work mode