Entry Level Equipment, Process, and Manufacturing Engineers - December 2023 and May 2024 Grads

NXP Semiconductors

Feb 28

Applications are closed

Job
Full-time
Entry Level
Engineering
Austin

Requirements

BS or MS in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, or similar is required, along with up to 2 years experience, including internships
Experience or coursework in the following are helpful in determining where you’d best fit in:
Knowledge of statistical process control
Knowledge of Lean principles and Lean Manufacturing techniques
Theoretical and/or practical knowledge of semiconductor fabrication processes,
Experience in Lean Manufacturing a plus
Ability to deal with multiple issues and shifting priorities
Strong verbal and written communication skills
Ability to interact with multiple disciplines in a 7x24 manufacturing facility
Strong verbal and written communication skills
Good Teamwork and a desire to work with people to create a positive work environment
Excellent Troubleshooting skills
Use of Oscilloscope and reading and understanding waveforms
Knowledge of quality improvement methods including FMEA, 8D and 3x5 Why is required.
Demonstrated skill in handling of customer complaints, from failure analysis to execution of root cause corrective action and implementation of best practices is a must.
Candidate must have excellent interpersonal and communication skills and be experienced with Microsoft Office and statistical data analysis tools such as JMP or Stata.
Working knowledge of Tableau and SQL is desired
Six-sigma Black Belt training highly desired
Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.
Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.
Knowledge of Statistical Analysis and Design of Experiment is a plus.
Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.

Responsibilities

Responsible for monitoring and controlling wafer fabrication processes and equipment
Implementation of Six-Sigma statistical process control methods
Prevent and reduce wafer scrap and defectivity
Improve equipment reliability and availability
Participate in cross-functional and Lean activity teams
Define manufacturing procedures
Develop and write process specifications
Determine root cause of defect issues, and drive resolution.
Partner with other engineers to reduce tool-level defect levels (both excursion reduction and baseline improvement)
Sample submissions process and validation of all required documentation
Develop tools to improve processes (ie. ADEPT, Databases, Tracking, Quartz)
Organize, implement and optimize production process flow
Develop working instructions and process documents
Sustain and improve processes to meet manufacturing demand for throughput and cycle time
Improve quality levels by driving to root cause to eliminate scrap and yield loss mechanisms
Identify and execute cost reduction solutions to meet Factory budget goals
Collaborate across teams to improve overall process performance
Reduce defectivity mechanisms and improve process control
Work with minimal supervision, balancing competing priorities, to serve the needs of the engineering and manufacturing communities
Work collaboratively with process and product engineers to enhance the quality and reliability performance of NXP products.
Utilize data analytics to help identify customer return common causes and evaluate the effectiveness of corrective actions across a wide range of products and technologies.
Serve as a focal point in the organization for structured problem solving, and as a liaison between the manufacturing and product organizations.
Establish, monitor, and develop improvement plans for quality key performance indicators.
Define and validate package designs, materials and processes used for development of new products for NXP.
Develop DOE’s and tests to evaluate suitability and reliability of package solutions.
Work with the Business Lines and the factories (both internal to NXP and subcons) to qualify the package/product solutions.
Manage the package process using industry standard project management tools.
Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing).
Address and solve materials and processing issues that may occur during the development process.

NXP Semiconductors

Secure Connections for a Smarter World.

Manufacturing & Electronics

Industry

10,001+

Employees

2006

Founded Year

Mission & Purpose

NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer and more sustainable world through innovation. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 31,000 employees in more than 30 countries and posted revenue of $11.06 billion in 2021.