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Hardware Developer

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Oracle

16d ago

  • Job
    Full-time
    Junior Level
  • Software Engineering
    Engineering
  • Santa Clara
    Remote

AI generated summary

  • You need experience with wind tunnel testing, CFD software, scripting in Python, thermal qualification tests, fan performance measurement, CAD design, and data acquisition systems for thermal performance.
  • You will design and test electronic components, build thermal models, automate data analysis, conduct thermal tests, measure fan performance, and create CAD models for cooling solutions.

Requirements

  • Use of different-sized wind tunnels to measure server/component-level airflow and pressure impedance;
  • Build high-accuracy thermal models using commercial CFD software including Flow Simulation, Flotherm, and Icepak;
  • Write and modify shell scripts and Python codes to automate thermal tests and post-process large data sets;
  • Conduct thermal qualification tests using thermal chambers and using software and applications including PTU, NVQual, FIO, and to stress different server components including CPU, GPU, Drives, and DIMMs;
  • Set up fans in wind tunnels to measure fan performance curves at different PWMs and setting up thermal test vehicles to measure heatsink performance at different power and airflow;
  • Fan Speed Control algorithm defining key parameters in Proportional, Integral, and Derivative control to meet thermal targets and optimize performance;
  • CAD tools including Solid Works and Creo to design extruded, skived, stamped, forged, vapor chamber, or heat pipe heatsink solutions by taking into consideration manufacturability and volume of production; and
  • Instrument different pressure, temperature, and acoustic sensors, and set up LabVIEW and Agilent data acquisition systems to measure server thermal performance.

Responsibilities

  • Evaluate reliability of materials, properties and techniques used in production; plan, design and develop electronic parts, components, integrated circuitry, mechanical systems, equipment and packaging, optical systems and/or DSP systems. Responsible for designing, developing, modifying and evaluating electronic, electromechanical or mechanical components, assemblies or integrated circuitry for hardware systems for the external market. Includes new design, as well as modification activities that results in significant product enhancement. Activities encompass design, analysis, testing and process development using engineering principles and methods. Technical disciplines may include electrical and logical design of printed circuits; mechanical design or electronics enclosures or integrated circuit packaging; and embedded software/firmware design. May telecommute.
  • Use of different-sized wind tunnels to measure server/component-level airflow and pressure impedance;
  • Build high-accuracy thermal models using commercial CFD software including Flow Simulation, Flotherm, and Icepak;
  • Write and modify shell scripts and Python codes to automate thermal tests and post-process large data sets;
  • Conduct thermal qualification tests using thermal chambers and using software and applications including PTU, NVQual, FIO, and to stress different server components including CPU, GPU, Drives, and DIMMs;
  • Set up fans in wind tunnels to measure fan performance curves at different PWMs and setting up thermal test vehicles to measure heatsink performance at different power and airflow;
  • Fan Speed Control algorithm defining key parameters in Proportional, Integral, and Derivative control to meet thermal targets and optimize performance;
  • CAD tools including Solid Works and Creo to design extruded, skived, stamped, forged, vapor chamber, or heat pipe heatsink solutions by taking into consideration manufacturability and volume of production; and
  • Instrument different pressure, temperature, and acoustic sensors, and set up LabVIEW and Agilent data acquisition systems to measure server thermal performance.

FAQs

What is the job title for this position?

The job title is Hardware Developer.

What company is offering this position?

The position is offered by Oracle America, Inc.

What are the primary responsibilities of a Hardware Developer in this role?

The primary responsibilities include evaluating materials, designing and developing electronic parts, integrated circuits, mechanical systems, and conducting thermal tests, among other tasks related to hardware systems for the external market.

What educational qualifications are required for this position?

The employer will accept a Master’s degree in Computer Science, Engineering, or a related technical field along with two years of experience in the job offered or in a hardware developer-related occupation.

What technical skills are required for this role?

Required technical skills include the use of wind tunnels for airflow measurement, building thermal models using CFD software, writing scripts in Python, conducting thermal qualification tests, and employing CAD tools such as Solid Works and Creo.

Is experience with thermal simulation software necessary?

Yes, experience with commercial CFD software including Flow Simulation, Flotherm, and Icepak is necessary for building high-accuracy thermal models.

Will the position involve developing software or scripts?

Yes, the position requires writing and modifying shell scripts and Python codes to automate thermal tests and process large data sets.

What tools will I need to use for designing heatsinks?

You will need to use CAD tools including Solid Works and Creo for designing heatsinks considering manufacturability and production volume.

Does this position require conducting physical tests?

Yes, conducting thermal qualification tests using thermal chambers and testing different server components is required.

Are there opportunities to telecommute for this position?

Yes, telecommuting options are available for this position.

Information Technology & Services

Technology
Industry
10,001+
Employees
1977
Founded Year

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