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LTD Advanced Interconnect Device Engineer

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Intel Corporation


1mo ago

đź’Ľ Graduate Job


AI generated summary

  • You must have a PhD in EE, Physics, or related field, with 6-month experience in semiconductor material and electrical characterization. Additional skills include process monitoring, interconnect fabrication, and proficiency in data analysis tools and programming languages.
  • You will define performance targets, analyze data, develop test structures, calibrate models, and propose new capabilities for interconnect devices at Intel Corporation.

Graduate Job

Software Engineering•Hillsboro


  • The Logic Technology Development (LTD) organization delivers the latest process technology innovations to drive Intel's amazing product roadmap.


  • You must possess the minimum qualifications below to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
  • The experience listed below would be obtained through a combination of your schoolwork/classes and project work/ experimental research and/or relevant previous job and/or internship experiences.
  • Minimum Qualifications
  • You must possess a PhD degree in Electrical Engineering, Physics, Material Science, Chemical engineering or related fields to semiconductor fabrication.
  • Minimum of 6-month experience in Semiconductor material characterization and fabrication.
  • Minimum of 6-month experience in Electrical characterization of Semiconductor device or elements (I-V, C-V, etc.)
  • Preferred Qualifications
  • Experience in process monitoring structure layout design and testing.
  • Experience in Semiconductor Interconnect fabrication and characterization
  • Expertise in database structures, research methods, machine learning, analytics packages (i.e., JMP, MATLAB, Octave), scripting languages (i.e., Python, JSL, Perl, TCL), or programming languages (i.e., SQL, C/C++)
  • Basic knowledge of CMOS device, Ring oscillator, integrated Circuits are a plus.

Education requirements


Area of Responsibilities

Software Engineering


  • Define Interconnect performance targets for Process Design Kit releases, interface with design teams to understand Interconnect performance impact on overall technology entitlement commits.
  • Use Statistics, Data Mining, and other data analysis techniques to collect, explore, and extract insights from Electrical-test, yield, and fab data.
  • Develop scripts, algorithms, and applications to translate experimental data into intelligence to define future development direction.
  • Define and Develop test structure design methodology to understand process marginality and performance capability of novel Interconnect processes.
  • Benchmark silicon data capability against technology goals through RC compact model calibration.
  • Propose and develop new compact model capabilities that accurately capture silicon behaviors.


Work type

Full time

Work mode