FAQs
What is the primary focus of the Module Development Engineer role at Intel's Hillsboro Campus?
The primary focus of the Module Development Engineer role is to drive wafer level assembly technology development (WATD) for future generations of heterogenous integrated packaging process technologies through innovation, product enhancement, and developing/enabling equipment and process capabilities.
What are some of the technologies being used and developed by Intel in the field of advanced packaging?
Intel is focusing on breakthrough advances in packaging through EMIB and Foveros technologies, as well as exploring other advanced packaging technologies for heterogenous integrated packaging.
What is the location of this job role?
This job role is located at the Ronler campus in Oregon.
What are some of the key responsibilities of a Module Development Engineer in this role?
Key responsibilities include driving innovation in wafer level assembly technology development, enhancing product capabilities, and developing and enabling equipment and process capabilities for heterogenous integrated packaging.
What is the working schedule for this role?
The Module Development Engineer role is a day shift position.