Logo of Huzzle

Oregon Disaggregation Manufacturing (ODM) Die Pick and Place Module Process Engineer

  • Job
    Full-time
    Entry Level / Graduate
  • Engineering
  • Hillsboro

AI generated summary

  • You need a Master's or Bachelor's degree in physics, Chemistry, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or Material Science plus relevant experience in a semiconductor or assembly setting.
  • You will be responsible for managing high volume manufacturing equipment and processes, conducting tests, recommending and implementing modifications for process improvements, growing manufacturing capacity, executing maintenance activities, owning continuous improvement initiatives, and transferring technology to global manufacturing sites.

Requirements

  • The candidate must possess at least one of the following degrees plus the years of experience determined for each degree in the areas specified below:
  • Master's degree in physics, Chemistry, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or Material Science.
  • Bachelor's degree in physics, Chemistry, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or Material Science and 1+ years in a semiconductor environment or assembly experience.

Responsibilities

  • You will be a member of the Oregon Disaggregation Manufacturing (ODM) organization working across the Ronler Acers campus and the Aloha campus. ODM processes internal and external products from the wafer level to the die level, then uses advanced Wafer Level Assembly for continued die level processing. ODM includes various process tools and this open position is specifically looking to fill an open position in the Die Pick and Placed module. Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost indicator goals. Grows insitu manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe. Owns execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required. Owns process development line items aligned to high volume process nodes. Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites. Owns development and optimization of excursion prevention systems for the equipment and process. Owns detection of discrepant material or activities of the equipment and process. During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes).

FAQs

What is the role of an Oregon Disaggregation Manufacturing (ODM) Die Pick and Place Module Process Engineer at Intel?

The role of an ODM Die Pick and Place Module Process Engineer at Intel involves working on semiconductor process development, manufacturing, yield improvement, packaging, final test and optimization, as well as Supply Chain and facilities support.

What are some key responsibilities of an ODM Die Pick and Place Module Process Engineer?

Some key responsibilities of an ODM Die Pick and Place Module Process Engineer include developing and optimizing processes for die pick and place modules, ensuring state-of-the-art semiconductor manufacturing, and collaborating with cross-functional teams for continuous improvement.

What skills are required for an ODM Die Pick and Place Module Process Engineer role?

Skills required for an ODM Die Pick and Place Module Process Engineer role include knowledge of semiconductor manufacturing processes, experience in process development and optimization, ability to work in a fast-paced environment, and strong collaboration and communication skills.

What is the significance of Moore’s Law in the context of this job?

Moore’s Law is significant in the context of this job as it drives the continuous improvement and innovation in semiconductor manufacturing, enabling smart, connected devices to reach every person on Earth. The ODM Die Pick and Place Module Process Engineer plays a crucial role in utilizing Moore’s Law to advance semiconductor technology.

Technology
Industry
10,001+
Employees
1968
Founded Year

Mission & Purpose

Intel’s mission is to shape the future of technology to help create a better future for the entire world. By pushing forward in fields like AI, analytics and cloud-to-edge technology, Intel’s work is at the heart of countless innovations. From major breakthroughs like self-driving cars and rebuilding the coral reefs, to things that make everyday life better like blockbuster effects and improved shopping experiences — they’re all powered by Intel technology. With a career at Intel, you have the opportunity to help make the future more wonderful for everyone.